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The main job responsibilities will include but not limited to:
- Responsible to drive the HW architecture and semiconductor component selection/decision for the next generation IVI (In-vehicle infotainment system), Telematics, ADAS, HPC platforms.
- Specialized in selecting and recommending next generation semiconductor solution for automotive IVI/ADAS/HPC system, electronics/ECU designing and developing the electronic components and systems that power car IVI/ADAS/HPC systems, ensuring high-quality and seamless integration with vehicle technology.
- This role involves working closely with vehicle Architecture/system Design, safety engineer & Buyer/purchasing ensuring that the chosen components meet the performance, reliability, and cost requirements of the applications.
- Technical expertise in recommending and proposing the right electronic components not limited to Display technology, Cluster technology, Audio amplifiers, MCU/MPU, SIP/SOC, Memories (UFS, LPDDR, Flash), Microphone interface/Audio ADC, Audio DSP, Audio power circuitry/PMIC, Speaker interface, Digital audio interfaces (A2B, Ethernet, etc.), working knowledge on ANC (Active noise cancellation) and RNC (Road noise cancellation) design.
- Familiarity with relevant automotive safety and quality standards, such as ISO 26262 and AEC-Q100.
- Experience with acoustic measurement instruments, Familiar with audio data acquisition, analysis systems and Audio Precision.
- Work proactively with silicon vendor partners to drive design features and technology road map.
- Support HW Engineering group during advanced design phases, system architecture definitions and ECU development / Qualifications.
- Drive the HW architecture decision for the next Stellantis automotive computing system/hardware architecture, taking consideration of key KPIs that deliver scalable, reusable and cost optimized platforms.
- Provide technical expertise in MCU/MPU/SoC Internal Architecture to maximize the ECU Hardware design efficiency/performance in the areas of Body, Propulsion, Chassis, Gateway, Zone, ADAS and Infotainment
- Provide technical expertise for ARM, RISC-V, HW accelerations, Neural network processing, Video decode/encode, Image processing, Audio processing, Camera & Display, Networking, and advanced memory technologies.
- Provide technical expertise for the best-in-class ISO26262 and Cyber security implementation.
- Support discussions between the HW Engineering and the Semiconductor groups for High level MCU/MPU/SoC specifications for IVI/ADAS/HPC systems.
- Support MCU/MPU/SoC/IVI technology roadmap definitions by regularly providing survey study of relevant industry technologies and chip solutions.Collaborate in a Scaled Agile product delivery team, comprised of cross-functional company peers to continuously prioritize, refine, and deploy component.
- Understand Stellantis Domain team requirements, project milestones, technology relevance.
Basic Qualifications:
- Bachelors Degree in Electrical/Electronics, Telecommunication, or equivalent Engineering discipline
- Minimum 10 years of experience in automotive embedded electronics designs or hardware/system architecture role
- Knowledge/Experience of IVI, Audio system, Automotive vehicle connectivity systems, ADAS/HPC and ECU design, development, and testing.
- Justified experience in ARM 32/64bits architecture, power management, high speed interfaces, memories, data networking (ETH, CANxx, LIN...)
- Strong teamwork spirit; excellent oral and written communication skills; ability to work independently in a global team environment.
Preferred Qualifications:
- Experience in industrial or automotive (preferred) area (TIER1, TIER2)
- Experience in RISC-V architecture, AI/ML, hypervisor technologies is a plus
- Experience in software engineering and software architecture development
- Knowledge of safety standards including ISO 26262, Euro NAP, and Security regulations
- Solid understanding of embedded electronics design constraints at the component and system level
- Understanding and knowledge of Board software/Bring up software, Audio DSP and MCUs.
Critical Character Traits to Ensure Success:
- Be curious
- Ability to think outside-the-box in high pressure situations
- Ability to multi-task
- Detail oriented problem-solver
- Self-starter with the ability to work independently given minimal supervision
- Ability to work in a team environment and be both a team player and task leader
- Respect and understanding of the Customer/Supplier relationship while embracing partnership
- Ability to present concepts/strategies/project status to large groups
The main job responsibilities will include but not limited to:
- Responsible to drive the HW architecture and semiconductor component selection/decision for the next generation IVI (In-vehicle infotainment system), Telematics, ADAS, HPC platforms.
- Specialized in selecting and recommending next generation semiconductor solution for automotive IVI/ADAS/HPC system, electronics/ECU designing and developing the electronic components and systems that power car IVI/ADAS/HPC systems, ensuring high-quality and seamless integration with vehicle technology.
- This role involves working closely with vehicle Architecture/system Design, safety engineer & Buyer/purchasing ensuring that the chosen components meet the performance, reliability, and cost requirements of the applications.
- Technical expertise in recommending and proposing the right electronic components not limited to Display technology, Cluster technology, Audio amplifiers, MCU/MPU, SIP/SOC, Memories (UFS, LPDDR, Flash), Microphone interface/Audio ADC, Audio DSP, Audio power circuitry/PMIC, Speaker interface, Digital audio interfaces (A2B, Ethernet, etc.), working knowledge on ANC (Active noise cancellation) and RNC (Road noise cancellation) design.
- Familiarity with relevant automotive safety and quality standards, such as ISO 26262 and AEC-Q100.
- Experience with acoustic measurement instruments, Familiar with audio data acquisition, analysis systems and Audio Precision.
- Work proactively with silicon vendor partners to drive design features and technology road map.
- Support HW Engineering group during advanced design phases, system architecture definitions and ECU development / Qualifications.
- Drive the HW architecture decision for the next Stellantis automotive computing system/hardware architecture, taking consideration of key KPIs that deliver scalable, reusable and cost optimized platforms.
- Provide technical expertise in MCU/MPU/SoC Internal Architecture to maximize the ECU Hardware design efficiency/performance in the areas of Body, Propulsion, Chassis, Gateway, Zone, ADAS and Infotainment
- Provide technical expertise for ARM, RISC-V, HW accelerations, Neural network processing, Video decode/encode, Image processing, Audio processing, Camera & Display, Networking, and advanced memory technologies.
- Provide technical expertise for the best-in-class ISO26262 and Cyber security implementation.
- Support discussions between the HW Engineering and the Semiconductor groups for High level MCU/MPU/SoC specifications for IVI/ADAS/HPC systems.
- Support MCU/MPU/SoC/IVI technology roadmap definitions by regularly providing survey study of relevant industry technologies and chip solutions.Collaborate in a Scaled Agile product delivery team, comprised of cross-functional company peers to continuously prioritize, refine, and deploy component.
- Understand Stellantis Domain team requirements, project milestones, technology relevance.
At Stellantis, we assess candidates based on qualifications, merit, and business needs. We welcome applications from all people without regard to sex, age, ethnicity, nationality, religion, sexual orientation, disability, or any characteristic protected by law. We believe that diverse teams reflect our identity as a global company, enabling us to better address the evolving needs of our customers and care for our future.
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